Post-press heat treatment process for improving the...

Details Post-press heat treatment process for improving the... Post-press heat treatment process for improving the...

B - Operations, Transporting

32

B

154/97

B32B 21/02 (2006.01) B27N 7/00 (2006.01) B29C 71/02 (2006.01)

Patent

CA 1308013

POST-PRESS HEAT TREATMENT PROCESS FOR IMPROVING THE DIMENSIONAL STABILITY OF A WAFERBOARD PANEL ABSTRACT OF THE DISCLOSURE There is provided a process for improving the thickness swelling properties of a manufactured waferboard panel. The process is based on the discovery that a correlative relationship exists between the relative thickness swelling properties versus the parametric properties of time and temperature. Thus the process involves subjecting the manufactured board to a post-heat treatment at a predetermined temperature for a predetermined time in order to obtain the desired percentage reduction in thickness swelling.

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