H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/38 (2006.01) C23C 22/52 (2006.01) C23C 22/83 (2006.01)
Patent
CA 2335816
A post-treatment method for copper on printed circuit boards is disclosed. The method comprises forming a cupric-based organometallic conversion coating on a copper surface of a printed circuit board, and then converting the cupric- based organometallic conversion coating to a cuprous-based organometallic conversion coating. The resulting cuprous-based organometallic conversion coating is desirable in that it improves copper to dielectric bond integrity.
L'invention concerne un procédé de post-traitement du cuivre sur des cartes de circuit imprimé. Ce procédé consiste à former un revêtement de conversion organométallique cuivrique sur une surface en cuivre d'une carte de circuit imprimé, puis à convertir ledit revêtement de conversion organométallique cuivrique en un revêtement de conversion organométallique cuivreux. Le revêtement de conversion organométallique cuivreux résultant est avantageux en ce qu'il améliore l'intégrité de la liaison cuivre diélectrique.
Mcgrath Peter T.
Owei Abayomi
Sarder Saeed
Yakobson Eric
Inc. Fry's Metals Inc. D.b.a. Alpha Metals
Mcgrath Peter T.
Owei Abayomi
Ridout & Maybee Llp
Sarder Saeed
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