Potting material for electronic components

Details Potting material for electronic components Potting material for electronic components

C - Chemistry, Metallurgy

08

L

C08L 95/00 (2006.01) H01F 27/02 (2006.01) H05K 5/06 (2006.01) H05K 7/00 (2006.01) C08K 3/36 (2006.01) H01F 38/10 (2006.01)

Patent

CA 2447758

A potting compound for electronic components comprises a first composition of asphalt and sand and a second composition that attenuates the forces normally applied by the first composition when it is used alone. The force attenuator preferably comprises solvent-refined heavy paraffinic petroleum oil from about 0.1 to 20 wt % of the compound.

Composé d'enrobage de composants électroniques comprenant une première composition d'asphalte et de sable, et une seconde composition qui atténue les forces normalement exercées par la première composition lorsque cette dernière est la seule utilisée. L'atténuateur de force comprend, de préférence, une huile de pétrole paraffinique dont le pourcentage massique comprend de 0,1 à 20 % du composé.

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