Powder coating method for producing circuit board laminae...

Details Powder coating method for producing circuit board laminae... Powder coating method for producing circuit board laminae...

B - Operations, Transporting

32

B

B32B 27/04 (2006.01) B05D 1/04 (2006.01) B05D 1/06 (2006.01) D06N 3/00 (2006.01) H05K 1/03 (2006.01) H05K 3/00 (2006.01) H05K 3/02 (2006.01) B32B 31/12 (1990.01)

Patent

CA 2104234

2104234 9215404 PCTABS00016 A fabric of multifilament bundles is coated by electrostatic powder deposition, to produce a fiber-reinforced composite web (10) that is especially well suited for lamination to produce susbtrates for circuit boards.

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