Powder coating process for seamless substrates

Details Powder coating process for seamless substrates Powder coating process for seamless substrates

G - Physics

03

G

117/23, 117/2.2

G03G 5/05 (2006.01) B29C 41/00 (2006.01) B29C 41/22 (2006.01) G03G 5/10 (2006.01) B29C 41/08 (2006.01)

Patent

CA 1313477

-1- ABSTRACT OF THE DISCLOSURE A process for the fabrication of seamless substrates which comprises (1) providing a substrate with a release coating composition thereover; (2) depositing thereon by electrostatic powder spraying a polymer; (3) melting the polymer blend; and (4) subsequently permitting the melted blend to cool. Thereafter, layered photoconductive imaging members can be prepared by the application, for example, of a ground plane, a photogenerating layer, and a charge transport layer.

531230

Affiliated with

Also associated with

Rating

Powder coating process for seamless substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Powder coating process for seamless substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Powder coating process for seamless substrates will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1295754