Power circuit package and fabrication method

Details Power circuit package and fabrication method Power circuit package and fabrication method

H - Electricity

01

L

H01L 23/00 (2006.01) H01L 23/02 (2006.01) H01L 23/48 (2006.01) H01L 23/488 (2006.01) H01L 23/52 (2006.01) H01L 25/00 (2006.01)

Patent

CA 2563480

A power circuit package (10) includes a base (12) including a substrate (14), a plurality of interconnect circuit layers (16) over the substrate with each including a substrate insulating layer (18) patterned with substrate electrical interconnects (20), and via connections (22, 24) extending from a top surface of the substrate to at least one of the substrate electrical interconnects (20); and a power semiconductor module (26) including power semiconductor devices (28) each including device pads (30) on a top surface of the respective power semiconductor device and backside contacts (31) on a bottom surface of the respective power semiconductor device, the power semiconductor devices being coupled to a membrane structure (32), the membrane structure including a membrane insulating layer (34) and membrane electrical interconnects (36) over the membrane insulating layer and selectively extending to the device pads, wherein the backside contacts (31) are coupled to selected substrate electrical interconnects or via connections.

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