Power distribution bus for integrated circuits

H - Electricity – 05 – K

Patent

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356/134

H05K 1/11 (2006.01) H01L 21/60 (2006.01) H01L 23/538 (2006.01) H01L 27/00 (2006.01) H01L 27/02 (2006.01)

Patent

CA 1038086

IMPROVEMENTS RELATING TO SEMICONDUCTOR INTEGRATED CIRCUIT DEVICES ABSTRACT A power bus element for use in large scale integrated circuits is described. Each bus element consists, for example, of a chip of silicon having two levels of metallizationthereon, one acting as an earth (or ground) return plane and the other providing power voltages. Dependent contacts on the chip make selective contact with metallization over the surface of the semiconductor wafer on which the chip is mounted. A power distribution line consists of a number of such bus elements linked together.

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