Power feed and heat dissipating device for power...

H - Electricity – 01 – L

Patent

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Details

H01L 25/04 (2006.01) H01L 23/36 (2006.01) H01L 25/11 (2006.01) H02K 11/04 (2006.01)

Patent

CA 2372440

In an electric circuit comprising a plurality of power semiconductor devices (1), each of the power semiconductor devices has a heat-dissipating metal part (5) that is electrically connected to an electrode of the device inside the semiconductor package, and the heat-dissipating metal parts of the power semiconductor devices of which the electrodes connected to the heat radiating metal parts are at the same potential are connected and fixed to an electrically conductive heat-dissipating body to use the body as a connecting terminal. Further, some of the heat-dissipating bodies are electrically connected and fixed to an electrically conductive heat-dissipating plate (7) to use it as a connecting terminal. Alternatively, the heat-dissipating bodies are electrically insulated from and fixed to another heat-dissipator (11).

Dans un circuit électrique comprenant une pluralité de dispositifs semi-conducteurs de puissance, chacun desdits dispositifs comporte un radiateur métallique (5) qui est relié électriquement à une électrode du dispositif à l'intérieur de l'ensemble semi-conducteur. Les radiateurs métalliques des dispositifs semi-conducteurs de puissance dont les électrodes connectées auxdits éléments métalliques se trouvent au même potentiel sont reliés et fixés à un corps de radiateur électriquement conducteur faisant office de borne de connexion. Par ailleurs, certains des corps de radiateur sont reliés électriquement et fixés sur une plaque radiateur électriquement conductrice (7) faisant office de borne de connexion. En variante, les corps de radiateur sont fixés à un autre dissipateur de chaleur (11) dont il sont isolés électriquement.

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