Power module assembly with reduced inductance

Details Power module assembly with reduced inductance Power module assembly with reduced inductance

H - Electricity

05

K

H05K 1/14 (2006.01) H02M 1/00 (2007.10) H05K 1/11 (2006.01)

Patent

CA 2719179

A device is provided that includes a first conductive substrate (102) and a second conductive substrate (104). A first power semiconductor component (118a) having a first thickness can be electrically coupled to the first conductive substrate. A second power semiconductor component (118b) having a second thickness can be electrically coupled to the second conductive substrate. A positive terminal (142) can also be electrically coupled to the first conductive substrate, while a negative terminal (144) can be electrically coupled to the second power semiconductor component, and an output terminal (146) may be electrically coupled to the first power semiconductor component and the second conductive substrate. The terminals, the power semiconductor components, and the conductive substrates may thereby be incorporated into a common circuit loop, and may together be configured such that a width of the circuit loop in at least one direction is defined by at least one of the first thickness or the second thickness.

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