Power module board and power module using the board

Details Power module board and power module using the board Power module board and power module using the board

H - Electricity

05

K

H05K 1/18 (2006.01) H01L 23/13 (2006.01) H01L 23/538 (2006.01) H01L 25/07 (2006.01)

Patent

CA 2276376

A ceramic base plate of aluminum nitride ceramics, for example, as a power module board has a metal layer on a surface of the ceramic base plate at a fixing portion at which the ceramic base plate is fixed onto a heat radiating plate. Further, a metal film is provided entirely on the rear surface of the ceramic base plate. An IGBT chip or the like is fixed onto the ceramic base plate with a conductive layer interposed therebetween to form a power module board. Therefore, it is possible to eliminate cracks which are generated when the ceramic base plate is mechanically fixed onto the heat radiating plate without the use of solder, and heat radiation from the ceramic base plate to the heat radiating plate, can be improved.

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