Power semiconductor module

Details Power semiconductor module Power semiconductor module

H - Electricity

01

L

H01L 23/02 (2006.01) H01L 23/34 (2006.01) H02M 7/00 (2006.01)

Patent

CA 2256778

An electronic module or package is disclosed for providing high reliability and high performance operation. The package comprises a hermetically sealed enclosure having a metallic baseplate and a ceramic cover, and containing one or more circuits or devices therein which typically are power rectifiers, bridges or power control circuitry. One or more power terminals are disposed on a terminal block compliantly supported on or above the baseplate, the terminals extending through the cover in hermetically sealed manner. Signal or control terminals may also be disposed on a terminal block compliantly supported on or above the baseplate, these terminals also extending through the cover in hermetically sealed manner. An adapter plate may be mounted on the cover and containing a plurality of terminals connected to the module terminals. The terminals of the adapter plate can be in any configuration to suit user requirements without requiring a change in the terminal configuration of the module itself. The adapter plate may also contain active and/or passive circuitry.

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