Power semiconductor package

Details Power semiconductor package Power semiconductor package

H - Electricity

01

L

356/3

H01L 23/40 (2006.01) H05K 7/20 (2006.01)

Patent

CA 2018808

POWER SEMICONDUCTOR PACKAGE ABSTRACT OF THE DISCLOSURE A hermetically sealed power semiconductor package includes a body 11 and a thick metal back 24. The metal back serves as a mounting device as well as a thermal channel for the package eliminating the need for intermediate heatsinks. For example, fasteners 47 extending into the back 24 can be used to mount the package to a printed wiring board 38 and directly to a heatsink 44.

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