Powerpack laser diode assemblies

Details Powerpack laser diode assemblies Powerpack laser diode assemblies

H - Electricity

01

S

H01S 5/022 (2006.01) H01S 5/02 (2006.01) H01S 5/024 (2006.01) H01S 5/042 (2006.01)

Patent

CA 2449884

In one aspect, the invention provides a laser diode assembly, comprising a carrier, a laser diode, a first bonding member, and a second bonding member. The carrier has a conductive layer formed thereon that is sized for attaching at least two bonding members thereto. The laser diode is operably coupled to the carrier and has first and second conductive pads formed thereon. The first and second conductive pads are each sized for attaching at least one bonding member thereto. The first bonding member couples the first conductive pad to the conductive layer of the carrier, and the second bonding member couples the second conductive pad to the conductive layer of the carrier.

L'invention concerne, selon un aspect de celle-ci, un ensemble diode laser, qui comprend un support, une diode laser, un premier élément de liaison, et un second élément de liaison. Sur le support, une couche conductrice possédant une taille permettant d'y fixer au moins deux éléments de liaison est formée. La diode laser est couplée fonctionnellement au support et une première et une seconde plages conductrices sont formées sur celle-ci. La taille des première et seconde plages conductrices permet la fixation sur celle-ci d'au moins un élément de liaison. Le premier élément de liaison couple la première plage conductrice à la couche conductrice du support, et le second élément de liaison couple la seconde plage conductrice à la couche conductrice du support.

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