Pre-matched module for an ultra-high frequency diode and a...

Details Pre-matched module for an ultra-high frequency diode and a... Pre-matched module for an ultra-high frequency diode and a...

H - Electricity

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356/61

H01L 23/02 (2006.01) H01L 23/043 (2006.01) H01L 23/66 (2006.01)

Patent

CA 1206275

A PRE-MATCHED MODULE FOR AN ULTRA-HIGH FREQUENCY DIODE AND A PROCESS FOR FORMING THE BIASING CONNECTION FOR THE DIODE ABSTRACT OF THE DISCLOSURE The invention provides a process for mounting an ultra- high frequency diode so as to form a pre-matched module. The module of the invention comprises a copper base, a quartz ring and a copper cover : these three parts, coated with gold at least on their facing faces, are assembled to- gether by thermocompression. Inside this case, the diode chip, soldered to the base via a gold heat sink is biased by a false"beam-lead" connection, a metal star whose arms are curved, which reduces the inductance and capacity of this connection with respect to the base. The false "beam-lead" is formed by metalizing a mesa obtained on a silicon wafer.

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