Precision machining of a warped wafer

Details Precision machining of a warped wafer Precision machining of a warped wafer

B - Operations, Transporting

29

D

B29D 11/00 (2006.01) G02F 3/00 (2006.01) G05B 19/401 (2006.01)

Patent

CA 2132116

Abstract A method of precision machining at least one cut into an article having a non-uniform surface, wherein the cut is of substantially constant depth relative to the non-uniform surface. One aspect of the invention is a machined optical wafer having two adjacent notches, to serve as a platform for a fiber optic pigtail, machined into the edge of the wafer. Another aspect of the invention is a method of automatically machining a plurality of notches into an optical wafer. For optical wafers having embedded light paths, light detected from these light paths may be used to compensate for the variation in embedded depth of the light paths.

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