C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
402/221, 96/252,
C08G 73/10 (2006.01) C08G 73/12 (2006.01) G03F 7/031 (2006.01) G03F 7/038 (2006.01) G03F 7/26 (2006.01) H05K 1/00 (2006.01) H05K 1/03 (2006.01) H05K 3/46 (2006.01)
Patent
CA 1335817
Disclosed is a polyimide precursor comprising a specific polyamic acid ester, polyamic amide or polyamic acid salt structure derived from a tetracarboxylic acid compound and a diamine compound, which can be converted by heating to a polyimide having low thermal stress. By blending a specific form of this novel polyimide precursor which has an ethylenic double bond, with a photopolymerization initiator, an excellent photopolymerizable composition can be obtained. Not only this precursor but also the crosslinked precursor obtained by the photopolymerization of the photopolymerizable composition can be converted by heating to a polyimide resin which has low thermal expansion coefficient, high heat resistance, excellent mechanical properties and satisfactory adhesion to a substrate. Hence, the precursor and the photopolymerizable composition can advantageously be utilized in the production of electrical and electronic components.
609189
Ai Hideo
Takahashi Hideaki
Asahi Kasei Kogyo Kabushiki Kaisha
Goudreau Gage Dubuc
LandOfFree
Precursor of a low thermal stress polyimide and a... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Precursor of a low thermal stress polyimide and a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Precursor of a low thermal stress polyimide and a... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1295832