C - Chemistry – Metallurgy – 08 – J
Patent
C - Chemistry, Metallurgy
08
J
18/674, 403/77,
C08J 9/14 (2006.01) B29C 44/34 (2006.01) C08J 9/18 (2006.01)
Patent
CA 1225200
ABSTRACT OF THE DISCLOSURE The present disclosure is directed to foam particles of a linear, uncrosslinked ethylenic resin which can be expansion molded by heating in its uncrosslinked state. The present disclosure is also concerned with a process for preparing foam particles of a linear uncrosslinked ethylenic resin and a process for the in-mold foam mold- ing of said resin particles.
451299
Fujie Akira
Yamagishi Tsukasa
Asahi Kasei Kogyo Kabushiki Kaisha
Macrae & Co.
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