Preparation of low density, low modulus ethylene copolymers...

Details Preparation of low density, low modulus ethylene copolymers... Preparation of low density, low modulus ethylene copolymers...

C - Chemistry, Metallurgy

08

F

402/613

C08F 210/02 (2006.01) C08F 10/02 (2006.01) C08F 210/16 (2006.01)

Patent

CA 1219400

- 38 - ABSTRACT OF THE DISCLOSURE Ethylene copolymers having a density of less than 0.91 g/cm3 and a 1% secant modulus of less than 140,000 kPa are continuously prepared in a fluidized bed without particle agglomeration by continuously contacting, in such fluidized bed, at a temperature of from 10°C up to 80°C, a gaseous mixture containing (a) ethylene and at least one higher alph olefin in a molar ratio of such higher alpha olefin to ethylene of from 0.35:1 to 8.0:1, and (b) at least 25 mol percent of a diluent gas, with a catalyst composition prepared by forming a precursor composition from a magnesium compound, titanium compound, and electron donor compound; diluting said precursor composition with an inert carrier; and activating the diluted precursor composition with an organoaluminum compound.

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