C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
18/1010, 154/97
C08L 97/02 (2006.01) B27N 1/00 (2006.01) B27N 3/00 (2006.01) C08K 5/20 (2006.01) C09J 133/06 (2006.01) C08L 61/20 (2006.01)
Patent
CA 2034130
A prepress sealer for use in the process of making wood composition board is provided. The prepress sealer incorporates a crosslinking resin and an aqueous dispersion of acrylic polymer particles. The acrylic polymer particles have a THF gel content of greater than about 70%. Use of the prepress sealer provides improved press release during board manufacture and improved surface toughness and water resistance to the produced board.
de Tommaso Gabriel Louis
Hsu Oscar Hsien-Hsiang
de Tommaso Gabriel Louis
Gowling Lafleur Henderson Llp
Hsu Oscar Hsien-Hsiang
Rohm And Haas Company
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