Pressure-sensitive adhesive

C - Chemistry – Metallurgy – 08 – F

Patent

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Details

C08F 255/06 (2006.01) C08L 51/06 (2006.01) C09J 4/06 (2006.01) C09J 7/02 (2006.01) C09J 123/18 (2006.01) C09J 133/08 (2006.01) C08L 23/02 (2006.01)

Patent

CA 2122029

2122029 9313149 PCTABS00024 Radiation-cured compositions are provided which are obtained from starting materials comprising (i) a blend of an acrylate ester and optionally a monoethylenically-unsaturated copolymerizable monomer; (ii) an alpha-olefin polymer; and (iii) a photoinitiator. The preferred compositions are pressure-sensitive adhesives having good adhesion to both low and high energy surfaces as well as possessing excellent low and high temperature performance properties.

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