Pressure-sensitive adhesive composition

C - Chemistry – Metallurgy – 08 – K

Patent

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Details

400/1, 400/1806,

C08K 5/16 (2006.01) C08G 18/69 (2006.01) C08L 13/00 (2006.01) C08L 15/00 (2006.01) C09J 7/02 (2006.01) C09J 175/00 (2006.01) C09J 175/04 (2006.01) C09J 175/14 (2006.01)

Patent

CA 1047663

ABSTRACT OF THE DISCLOSURE A pressure-sensitive adhesive composition comprising a liquid diene polymer containing in the molecule thereof an average of about 2.0 to about 2.5 functional groups capable of reacting with an isocyanate group, an isocyanate compound containing in the molecule thereof 2 or more isocyanate groups and a tackifier containing therein at least one polar group selected from the class consisting of -COOH, OH, and -CH2OH, wherein the isocyanate compound is present in such amount that the isocyanate group(s) of the isocyanate compound is/are present in an amount of about 0.75 to about 1.2 equivalents per equivalent of the functional groups of the liquid diene based polymer, and the tackifier is present in an amount of about 10 to about 70, preferably 30 to 60, parts by weight per 100 parts by weight of the total weight of the liquid diene polymer and the isocyanate compound. This pressure-sensitive adhesive composition is coated on a support and heated to produce a pressure-sensitive layer, whereby a pressure-sensitive adhesive tape, for example, can be obtained.

241892

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