C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 133/08 (2006.01) B32B 7/12 (2006.01) C08F 220/12 (2006.01) C09J 7/02 (2006.01) C09J 133/06 (2006.01) C09J 133/24 (2006.01)
Patent
CA 2056702
The pressure sensitive adhesive composition is favorably utilized for lamination of plastic molded articles, particularly molded articles of polycarbonate resins and molded articles of acrylic resins because formation of blisters, such as bubbles and liftings, is prevented. It is favorably utilized for pressure sensitive adhesive sheets for surface protection because increase of adhesive strength is small, staining of the surface of the substrate is prevented and removability is excellent. It is also favorably utilized for electric insulation tapes because corrosion resistance, creep property and solvent resistance are excellent. The pressure sensitive adhesive composition comprises as the main component thereof a specific acrylic copolymer prepared by copolymerization of a specific methyleneamine derivative of acrylamide, a specific amine derivative of acrylimide, a specific diacetone derivative of acrylamide and a specific ester of acrylic acid.
Fukada Hajime
Miyajima Norihisa
Ozaki Issei
Gowling Lafleur Henderson Llp
Lintec Corporation
Saiden Chemical Industry Co. Ltd.
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