C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
117/28
C09J 7/02 (2006.01) B05B 15/04 (2006.01)
Patent
CA 1338104
A pressure-sensitive adhesive layer having, on at least one surface thereof, a layer of evenly dispersed non-adhesive solid particles having an average particle diameter of 10 to 60 microns, wherein at least about half of the solid particles project from the surface of the adhesive layer to a height corresponding to at least about one-fourth of the average particle diameter of the solid particles, and if the solid particles are hollow particles, the walls of the hollow particles are not rupturable by the pressure of bonding. The pressure- sensitive adhesive layer has a very low initial adhesion strength (adhesion strength before press-bonding). After press-bonding, it rapidly develops adhesion strength, and attains a very high final adhesion strength.
581574
Kinsen Kazuhisa
Ochi Katsura
Oonishi Yasuaki
Nippon Carbide Kogyo Kabushiki Kaisha
Smart & Biggar
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