Pressure-sensitive adhesive tapes for bonding printing...

C - Chemistry – Metallurgy – 09 – J

Patent

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Details

C09J 7/02 (2006.01) B41F 27/06 (2006.01) B41F 27/14 (2006.01) C09J 153/02 (2006.01)

Patent

CA 2663208

The invention relates to the use of a pressure-sensitive adhesive comprising at least one resin-polymer blend of at least 50% by weight of one or more block copolymers comprising polymer blocks based on vinylaromatics and comprising polymer blocks based on 1,3-dienes and not more than 50% by weight of at least one tackifier resin for an adhesive tape for bonding flexible printing plates to printing cylinders or printing sleeves.

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