C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 171/02 (2006.01) C09J 183/05 (2006.01)
Patent
CA 2541571
The present invention aims to provide an adhesive composition enabling to obtain a cured product having good adhesion properties. The present invention secondarily aims to reduce the amount of adhesive resin to be used by providing it with such good adhesion properties. The adhesive composition essentially contains (A) a polyoxyalkylene polymer having at least one alkenyl group in one molecule, (B) a compound having 1-3 hydrosilyl groups in one molecule on average, and (C) a hydrosilylation catalyst.
La présente invention concerne une composition adhésive qui permet d'obtenir un produit polymérisé présentant de bonnes propriétés d'adhérence. L'invention a accessoirement pour objet de réduire la quantité d'une résine adhésive utile, en lui conférant lesdites bonnes propriétés d'adhérence. La composition adhésive contient essentiellement: a) un polymère de polyoxyalkylène comprenant au moins un groupe alcényle dans une molécule; b) un composé présentant en moyenne des groupes 1-3 hydrosilyle dans une molécule; et c) un catalyseur d'hydrosilylation.
Komitsu Shintaro
Ueda Kazuhiko
Fetherstonhaugh & Co.
Kaneka Corporation
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