Pressure sensitive hot melt adhesive curable by exposure to...

Details Pressure sensitive hot melt adhesive curable by exposure to... Pressure sensitive hot melt adhesive curable by exposure to...

C - Chemistry, Metallurgy

09

J

204/91.62

C09J 7/00 (2006.01) C09J 7/02 (2006.01) C09J 133/06 (2006.01)

Patent

CA 1127592

ABSTRACT PRESSURE SENSITIVE HOT MELT ADHESIVE CURABLE BY EXPOSURE TO ELECTRON BEAM RADIATION Hot melt pressure sensitive adhesives are prepared by free- radical copolymerization of at least one copolymerizable acrylic monomer with allyl acrylate or methacrylate to produce a prepolymer with an ethylenically saturated backbone containing pendant allylic unsaturation. This solid prepolymer is then heated to a temperature sufficient to render it fluid and is applied in fluid form to a substrate. The substrate is thereafter subjected to electron beam radiation to crosslink the prepolymer to provide a cured pressure sensitive adhesive.

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