Pressure sensitive hot-melt adhesive system

Details Pressure sensitive hot-melt adhesive system Pressure sensitive hot-melt adhesive system

C - Chemistry, Metallurgy

09

J

400/1800, 400/30

C09J 7/04 (2006.01) B44C 1/17 (2006.01) C08G 63/668 (2006.01) C08L 33/06 (2006.01) C09J 7/02 (2006.01) C09J 123/08 (2006.01) C09J 167/00 (2006.01)

Patent

CA 1101145

Abstract of the Disclosure A hot melt adhesive system which has pressure-sensitive adhesive characteristics at room temperature comprising a blend of a heat-acti- vatable hot melt adhesive containing therein inherently tacky elastomeric copolymer microsheres. The microspheres consist of 90 to 99.5 percent by weight of cleophilic, water-emulsifier alkyl acrylate ester and 0.5 to 10 percent by weight of an ionic monomer or maleic anhydride.

289840

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