Pressure-sensitive hot-melt adhesives adhering to flexible...

Details Pressure-sensitive hot-melt adhesives adhering to flexible... Pressure-sensitive hot-melt adhesives adhering to flexible...

C - Chemistry, Metallurgy

09

J

C09J 153/02 (2006.01) C09J 123/02 (2006.01) C09J 123/08 (2006.01)

Patent

CA 2669769

A description is given of a pressure-sensitive hot-melt adhesive which features good low-temperature adhesion. The adhesive is used to bond film substrates to one another or to cardboard packaging. The adhesive is to contain 2% to 50% of styrene block copolymers, 1% to 30% of EVA polymers, and also 20% to 70% of tackifying resins and 5% to 40% of plasticizer. Suitability is possessed more particularly by mixtures with SIBS polymer.

L'invention concerne un auto-adhésif fondu qui présente une bonne adhérence à froid. L'adhésif sert à coller des substrats en feuilles les uns avec les autres ou sur des cartonnages. L'adhésif doit contenir 2 à 50 % de copolymères en bloc de styrène, 1 à 30 % de polymères EVA et 20 à 70 % de résine à pouvoir adhésif et 5 à 40 % de plastifiant. En particulier, des mélanges avec des polymères SIBS sont appropriés.

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