G - Physics – 01 – L
Patent
G - Physics
01
L
G01L 1/04 (2006.01) E05F 15/00 (2006.01) G01L 7/02 (2006.01) H01H 1/58 (2006.01) H01H 3/14 (2006.01)
Patent
CA 2413864
According to a pressure sensitive sensor and a method of treating a terminal of a pressure sensitive sensor of the invention, a covering portion is formed by a thermoplastic resin material for hot melt molding or a photo-curing resin material cured by absorbing light energy. That is, molding pressure in molding is lower than molding pressure in molding by a general injection molding method. Therefore, a possibility of effecting adverse influence on respective connecting portions of an electrode line, a resistor, a conductive piece and a lead wire by the molding pressure is extremely low and disconnection caused by operating the molding pressure on the connecting portions can reliably be prevented.
Ishihara Hidenori
Kato Manabu
Tsuda Hirokazu
Asmo Co. Ltd.
Gowling Lafleur Henderson Llp
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