Pressure sensor assembly

Details Pressure sensor assembly Pressure sensor assembly

G - Physics

01

L

73/3

G01L 1/18 (2006.01) G01L 9/00 (2006.01) G01L 19/14 (2006.01)

Patent

CA 1149192

D-4,276 C-3264 PRESSURE SENSOR ASSEMBLY Abstract of the Disclosure A pressure sensor element comprising a silicon chip having a diaphragm formed therein with piezoresistive strain responsive resistors is mounted in a housing of molded polyester material having a much different temperature coefficient of expansion than the chip. The chip is protected from thermally induced and other stresses by a mounting arrangement comprising a glass base secured to the housing by a soft adhesive which largely prevents stress being transmitted from the housing to the base, wherein the base has a short pedestal on which a glass die is mounted which, in turn, supports the silicon chip. The short pedestal adds localized rigidity to the base so that any stresses in the base are taken up outside the region of the pedestal. One face of the glass die is bonded to the base by a relatively soft epoxy to further inhibit stress transmission and the silicon chip is securely bonded to the opposite face of the die. Contacts on the silicon chip are wire bonded to conductors which are insert molded in the housing.

377807

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