Pressure sensor with high modulus support

Details Pressure sensor with high modulus support Pressure sensor with high modulus support

G - Physics

01

L

G01L 9/12 (2006.01) G01L 7/08 (2006.01) G01L 9/00 (2006.01)

Patent

CA 2105483

ABSTRACT OF THE DISCLOSURE A metal thin film bonds a semiconductor bonding region of a diaphragm layer to a ceramic bonding region of a high modulus support block. The arrangement isolates a pressure sensing diaphragm from undesired strain, improving sensor accuracy. A passageway through the support block couples the fluid pressure to the sensing diaphragm to deflect it. Capacitive coupling between the diaphragm and a capacitor plate on the support block sense the deflection and provide an output representative of pressure.

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