Pretreatment composition and process for tin/lead plating

Details Pretreatment composition and process for tin/lead plating Pretreatment composition and process for tin/lead plating

C - Chemistry, Metallurgy

23

G

149/14

C23G 1/10 (2006.01) C23C 18/18 (2006.01) C23F 1/18 (2006.01) H05K 3/26 (2006.01) H05K 3/34 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2035578

ABSTRACT OF THE DISCLOSURE Metallic surfaces to be provided with a tin-lead coating from an immersion tin-lead bath, and particularly copper surfaces (e.g., through-holes, pads) of a printed circuit board having other metallic surfaces thereon covered by a hydrophobic solder mask, are prepared for receipt of immersion tin-lead coating by, e.g., contact thereof with a strongly acidic aqueous pre-dip solution containing at least one surface active agent functional to reduce the surface tension of the pre-dip solution and/or to provide the solution with improved affinity for the metallic surface.

Affiliated with

Also associated with

Rating

Pretreatment composition and process for tin/lead plating does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pretreatment composition and process for tin/lead plating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pretreatment composition and process for tin/lead plating will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1369812