Pretreatment process in flour milling method

Details Pretreatment process in flour milling method Pretreatment process in flour milling method

B - Operations, Transporting

02

B

B02B 3/00 (2006.01) B02B 1/08 (2006.01)

Patent

CA 2203950

A pretreatment process in a flour milling method in which raw wheat grains are first polished and the polished grains are ground and milled for producing end flour, includes a first polishing step, a second polishing step, a third polishing step, and a step of adding water. In the first polishing step a pericarp of each wheat grain is removed, in the second polishing step a seed coat of each raw wheat grain is removed, in the third polishing step a part of cell walls of aleuron layer cells that was in contact with the removed seed coat is removed so that a cell membrane of the aleuron layer cell is caused to be ruptured and that a substance in the aleuron layer cell is caused to be in a state which permits the substance to flow out. In step of adding water, by adding the water to each raw wheat grain, the substance in the aleuron layer cells is caused to flow out from the aleuron layer cells, resulting in producing a polished grain in a state in which the substance in the aleuron layer cell has been separated from each raw wheat grain. It is possible to increase the yield of the end flour collected by the subsequent grinding operation.

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