C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
400/5320
C09J 143/04 (2006.01) C09D 4/00 (2006.01) C09D 143/04 (2006.01) C09D 183/04 (2006.01) C08L 83/04 (2006.01)
Patent
CA 2036735
-22- PRIMER COMPOSITIONS EXHIBITING HEAT RESISTANT BONDING ABSTRACT Improved primer compositions comprise A) at least one member of a specified group of ethylenically unsaturated organosilicon compounds containing silicon-bonded alkoxy groups, B) silicone/organic copolymers prepared from esters of ethylenically unsaturated organic acids and organosilicon compounds derived from these acids, C) organohydrogensiloxane curing agents and D) a solvent. The improvement resides in the presence in the primer composition of an organic peroxide in an amount sufficient to retain the bonding properties of the primer composition at temperatures of at least 100°C. The solvent portion of the primer composition preferably comprises at least 50 percent by weight of an ethylenically unsaturated alcohol containing from 4 to 6 carbon atoms.
Dow Corning Corporation
Gowling Lafleur Henderson Llp
Larson Kent R.
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