H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/34 (2006.01) B23K 35/00 (2006.01) B23K 35/26 (2006.01) H05K 1/14 (2006.01)
Patent
CA 2279956
A printed circuit assembly (36) comprises a printed circuit board (30) with nickel (42) and gold (44) plated pads and solder (46) having a composition of approximately 90 % lead and 10 % antimony. The printed circuit assembly is IR or convection reflowed at a temperature between approximately 280 and 290 degrees C, and maintains solder connection integrity when the printed circuit assembly (36) is later incorporated into a second printed circuit assembly using a standard tin-lead solder system.
La présente invention concerne un ensemble circuit imprimé (36) comprenant une carte à circuit imprimé (42) où les plots de contact sont plaqués de nickel (42) et d'or (44), le métal d'apport de soudure étant composé d'environ 90 % de plomb, et 10 % d'antimoine. L'ensemble circuit imprimé, qui a ensuite été soumis à une refusion infrarouge ou par convection à une température se situant approximativement entre 280 et 290 ·C, conserve l'intégrité de ses soudures lorsqu'on incorpore ultérieurement l'ensemble circuit imprimé (36) à un second ensemble circuit imprimé en utilisant un système standard de soudure étain-plomb.
Gowling Lafleur Henderson Llp
Pulse Engineering Inc.
LandOfFree
Printed circuit assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Printed circuit assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit assembly will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1947275