Printed circuit assembly with flexible support

Details Printed circuit assembly with flexible support Printed circuit assembly with flexible support

H - Electricity

05

K

H05K 1/00 (2006.01) H05K 1/02 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2279949

A printed circuit (10) includes a flexible support (11) on which is adhered a coat of conductive material (12), formed by tracks (13). An adhesive (14) maintains the conductive material in place. The adhesive is able to withstand high temperatures and has to withstand strains due to folding the circuit assembly. In certain embodiments torsion is also a concern since the conductive coat (12) that is folded may be up to 800 microns thick, which could otherwise cause delamination, i.e., the separation of the conductive layer (12) and the substrate (11) due to lack of adherence between both layers.

La présente invention concerne un circuit imprimé (10) comprenant un support flexible (11) sur lequel adhère un revêtement de matériau conducteur (12) formé par des tracés (13). Un adhésif (14) maintient le matériau conducteur en place. Cet adhésif est capable de supporter des températures élevées et il doit résister aux contraintes entraînées par le pliage de l'ensemble circuit. Certains modes de réalisation prêtent une attention particulière à la torsion étant donné que le revêtement conducteur (12) plié peut présenter une épaisseur allant jusqu'à 800 microns, et que cette torsion pourrait provoquer un délaminage, c'est-à-dire la séparation de la couche conductrice (12) et du substrat (11) s'il y avait un manque d'adhérence entre les deux couches.

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