H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 1/18 (2006.01) H05K 3/46 (2006.01)
Patent
CA 2553904
The invention relates to an arrangement which is used to increase the density of the components of a printed circuit board (1) comprising electric components (2) which can be mounted on the surface. The printed circuit board (1) is formed by two films (3x, 3y) which are pressed against each other and comprises a dielectric (4) which is disposed therebetween. At least one of the of the opposite sides (3a, 3b) of the films (3x, 3y) is fitted with electric components (2) which can be mounted on the surface. According to the invention, holes (6b), which are used to connect both films (3x, 3y) (3x, 3y) in the printed circuit board (1), are provided and each of the holes (6b) is a direct connection of said opposite sides (3a, 3b) of the films (3x, 3y).
L'invention concerne un dispositif permettant d'augmenter la densité d'équipement d'une plaquette à circuits imprimés (1) à composants électriques (2) pouvant être montés en surface, ladite plaquette (1) étant formée de deux feuilles (3x, 3y) compressées mutuellement et comportant un diélectrique (4) disposée entre elles, au moins l'une des faces opposées (3a, 3b) des feuilles (3x, 3y) étant munie de composants électriques (2) pouvant être montés en surface. L'invention est caractérisée en ce qu'il est prévu, pour l'assemblage des deux feuilles (3x, 3y) dans la plaquette de circuits imprimés, des trous d'interconnexion (6b), et en ce que chacun de ces trous (6b) constitue une liaison directe desdites faces opposées (3a, 3b) des feuilles (3x, 3y).
Eads Deutschland Gmbh
Robic
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