Printed circuit board having low impedance interconnect...

Details Printed circuit board having low impedance interconnect... Printed circuit board having low impedance interconnect...

H - Electricity

01

R

H01R 12/02 (2006.01)

Patent

CA 2311716

There is provided a printed circuit board with a number of conductive layers and dielectric layers arranged in alternating sequence to form a laminate. The laminate includes one or more external conductive layers, one or more external dielectric layers and a number of internal conductive and dielectric layers. One or more tabs extend from a sidewall of the laminate for attachment to a mating connector. Each tab includes a first and a second conductive face in opposed relationship and an insulative barrier between them. The first and second conductive faces are respectively contiguous with first and second selected internal conductive layers of the laminate so as to enable a source and a return current to flow between the selected internal conductive layers and the mating connector.

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