Printed circuit board immersion soldering

Details Printed circuit board immersion soldering Printed circuit board immersion soldering

H - Electricity

05

K

356/22

H05K 3/34 (2006.01) B23K 3/06 (2006.01)

Patent

CA 1167978

ABSTRACT OF THE DISCLOSURE: A printed circuit board solder leveling device comprising guides distributed across the width of the soldering bath container. Each guide comprises opposed guide rods spaced apart a distance greater than the thick- ness of a printed circuit board so that there is loose contact only of the guides with opposite sides of the boar And a process for introducing and removing a printed cir- cuit board into said device.

385416

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