H - Electricity – 05 – K
Patent
H - Electricity
05
K
148/59, 113/89
H05K 3/34 (2006.01) B23K 35/36 (2006.01)
Patent
CA 1193949
Abstract of the Disclosure The present invention relates to a method of wave soldering an assembly composed of a plurality of electrical conductors disposed on a surface of a sheet of insulating material. In accordance with this method, the surface of the sheet and the conductors are contacted with a stationary wave of molten solder having a polyether admixed therewith and floating on the surface thereof. The polyether is a heteric or block copolymer of a dihydroxyphenol and at least one lower alkylene oxide. It is preferred that the alkylene oxide contain 2 to 4 carbon atoms. The alkylene oxide may be all ethylene oxide or may be a mixture with other lower alkylene oxides such as propylene oxides and butylene oxides. In any event, the copolymer should contain at least about 20 percent by weight of oxyethylene groups, balance oxypropylene groups and/or oxybutylene groups. A conventional polymeric oxidation inhibitor may also be included.
394399
Cuddy William A.
Eisenstein Stephen E.
Thir Basil
Basf Wyandotte Corporation
Robic Robic & Associes/associates
LandOfFree
Printed circuit board soldering does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Printed circuit board soldering, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit board soldering will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1335563