H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/19, 400/7013
H05K 3/42 (2006.01) C25D 5/54 (2006.01)
Patent
CA 1315417
Abstract of the Disclosure A process is described for manufacturing through- hole plated single-layer or multi-layer printed circuit boards based on a polymeric substrate material or on a ceramic material provided optionally on both sides with at least one electoconductive layer by electroplating or electroless plating with a metal layer also on those surfaces which have not been coated with a conductive metal layer, said process being characterized in that a) the surfaces of the substrate are pre-treated in a solution having oxidizing activity, b) after removal of the residual solution by rinsing, the substrate is introduced into a solution which contains at least one monomer, and more specific- ally pyrrole, furane, thiophene or derivative(s) thereof, which in a polymeric or copolymer form is electrically conductive, c) The substrate is then transferred into an acidic solution whereby an electrically conductive poly- meric layer, more specifically of polymerized or coploymerized pyrrole, furane, thiophene or deriv- ative(s) thereof, whereupon, if desired or required, any residual solution is removed by rinsing, and the galvanic or electroless metallization is carried out.
592628
Hupe Jurgen
Kronenberg Walter
Blasberg Oberflachentechnik Gmbh
Ogilvy Renault Llp/s.e.n.c.r.l.,s.r.l.
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