H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/16
H05K 3/00 (2006.01)
Patent
CA 1284842
A B S T R A C T PRINTED CIRCUIT BOARDS AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS A printed circuit board is described in which an electrically insulating laminate material (40) has first and second sides. An electrically conducting first circuit pattern (15) is embedded in the first side of the laminate material (40), and an electrically conducting second circuit pattern (20) is embedded in the second side of the laminate material (40) electrically insulated from the first circuit pattern (15) by the laminate material (40). A solid interconnection member (20) extends through the laminate material (40) and electrically contacts both the first and second circuit patterns (15,20) at selected locations thereof. The method for fabricating the board includes as a first step the fabrication of a first board panel (10) having a raised electrically conducting first circuit pattern (15) extending from a base layer (14) of conductive material and a raised electrically conducting second circuit pattern (20) extending from the first circuit pattern (15). A second board panel (30) is also fabricated, having a raised electrically conducting third circuit pattern (35) extending from another base layer (34) of conductive material. The first board panel (10) is laminat- ed to the second board panel (30) with a laminate insulat- ing material (40) disposed therebetween electrically insulating the first circuit pattern (15) from the third circuit pattern (35) and with the second circuit pattern (20) electrically contacting the first circuit pattern (15) at selected portions thereof. Finally, the base layers (14,34) of conductive material are removed from the lami- nate insulating material (40).
576332
Decker Richard W.
King David R.
Lee Mark S.
Decker Richard W.
King David R.
Lee Mark S.
Smart & Biggar
Westinghouse Electric Corporation
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