Printed circuit boards having improved adhesion between...

Details Printed circuit boards having improved adhesion between... Printed circuit boards having improved adhesion between...

H - Electricity

05

K

117/23

H05K 1/00 (2006.01) B23K 35/22 (2006.01) H05K 3/28 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1268670

PRINTED CIRCUIT BOARDS HAVING IMPROVED ADHESION BETWEEN SOLDER MASK AND METAL ABSTRACT A printed circuit board having improved adhesion between solder mask and metal includes a primer film on the metal deposited from an aqueous solution which includes 0.01 to 10% by weight of a carboxyl-containing polymer or copolymer .

503670

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