Printed circuit element comprising a polyimide- containing...

Details Printed circuit element comprising a polyimide- containing... Printed circuit element comprising a polyimide- containing...

H - Electricity

05

K

356/12, 154/126.

H05K 1/11 (2006.01) C08G 73/10 (2006.01) H01B 3/30 (2006.01) H05K 3/28 (2006.01) H05K 3/38 (2006.01)

Patent

CA 1248242

A B S T R A C T A printed circuit element comprising a polylmide- containing cover layer The invention relates to a printed circuit element in which the outer conductor layers or the electrical components arranged thereon are provided with a cover layer. The cover layer consists of heat-sealable high- temperature adhesive which is joined to a layer of intractable fully aromatic polyimide. The described circuit elements show very good mech- anical, thermal and electrical properties and may be used with advantage inter alia in electronics, in radio and computer technology, in electric motors and in aircraft and aerospace and telecommunications.

502504

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