Printed circuit with thermal dissipator

H - Electricity – 05 – K

Patent

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356/3

H05K 7/20 (2006.01) H05K 1/02 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1297595

PRECIS DE DIVULGATION Le circuit imprimé selon l'invention comprend, pour le montage et la soudure des boîtiers de composants électroniques, deux faces respectives, des pistes conductrices, des trous pour loger les pattes des boîtiers, et un dissipateur thermique constitué par une pièce métallique munie de pattes implantées dans des trous de la carte au voisinage des pattes des boî- tiers. Une plage métallique forme un chemin d'adduction thermi- que entre au moins un boîtier et le dissipateur. L'invention permet d'améliorer l'efficacité de l'évacuation calorifique permise par le dissipateur sans compliquer le processus de fabrication du circuit.

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