Printed substrate through which very strong currents can...

H - Electricity – 05 – K

Patent

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Details

H05K 1/02 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2668048

The invention relates to a printed circuit or substrate plate (10) which is intended to receive electronic components and is provided with printed conductor tracks (12). According to the invention, one or more conductor bars (18) are mounted one after the other between the connecting conductor surfaces (140, 142, 144), said conductor bars (18) being electrically interconnected during a subsequent wave soldering process or in a remelt furnace.

Sur une plaque (10) de substrat ou de circuit imprimé destinée à recevoir des composants électroniques et comportant des pistes conductrices (12) imprimées sur cette plaque, il est prévu un ou plusieurs barreaux conducteurs (18) montés les uns à la suite des autres entre des surfaces conductrices de liaison (140, 142, 144), les barreaux conducteurs (18) étant électriquement reliés entre eux lors d'un processus de soudage ultérieur à la vague ou dans un four à refusion.

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