Printed wire boards and method of making same

B - Operations – Transporting – 32 – B

Patent

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Details

B32B 5/12 (2006.01) B23C 5/28 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2110678

2110678 9222191 PCTABS00018 The invention relates to a method of manufacturing a supporting board for printed circuits and to the board so obtainable, the method comprising the following steps: manufacturing an electrically non-conducting synthetic layer reinforced with unidirectionally oriented fibres, which will not be made to flow during the subsequent steps; coating at least part of the aforementioned unidirectional laminate with an adhesive on one or both sides; stacking the laminates which have at any rate been coated in part with an adhesive in such a way that there is at least one layer of adhesive between each pair of layers and practically the same amount of material of even thickness and composition is disposed in the virtually perpendicularly intersecting orientation directions; bonding the stacked UD-laminates by activating the adhesive layers.

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