H - Electricity
05
K
356/6, 117/8
H05K 1/02 (2006.01)
Patent
CA 1243414
ABSTRACT OF THE DISCLOSURE Described herein is a composite structure comprising (a) a solid dielectric support surface; (b) a layer or pathway comprising a thermoset resin and containing sufficient electrically conductive metal particles, in the configuration of at least an electric circuit element, to provide desired properties and preferably to satisfy the Soldering Standard Test (hereinafter defined) and preferably to provide an electric circuit element having a low surface resistivity of 0.1 ohm per square or less. Also described are inks for printed circuit devices, circuit transfer means, and methods for making the same.
528326
Morgan Noredin H.
Seeger Richard E. Jr.
Ogilvy Renault Llp/s.e.n.c.r.l.,s.r.l.
Solvay Advanced Polymers L.l.c.
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