Procedure and device for processing cutting material

Details Procedure and device for processing cutting material Procedure and device for processing cutting material

D - Textiles, Paper

06

H

D06H 7/00 (2006.01) B23K 26/00 (2006.01)

Patent

CA 2161272

The invention relates to a procedure for optimizing the processing of cutting material, such as, textiles, leather and technical fabrics and the like, as well as a device to perform said procedure, the cutting patterns (T1, T2, T3) contained in the main memory of a computer (1) being firstly selected and made visible by means of direct laser projection possibly with different colours on a working surface (AF) in their original size and scaled down (LS2) on a control panel (4)for optimizing the working steps, said laser projections of said individual patterns then being interlocked by means of a control unit (5) actuated by an operator (P) in such a way on the area to be processed, i.e. the cutting material (6), such as, a leather skin or the like, that the conditions of said cutting material, such as, defective spots (F1, F2, F3, F4), shape, etc. can be accounted for by said operator positioned by said working surface, before the data thereby acquired are transmitted by an instruction given by said operator to a cutting unit, such as, an automated cutter (C), and the cutting operation is triggered.

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