Procedure for the deposition of firmly adhering silver films

Details Procedure for the deposition of firmly adhering silver films Procedure for the deposition of firmly adhering silver films

C - Chemistry, Metallurgy

23

C

117/83, 204/96.3

C23C 16/18 (2006.01) C23C 16/56 (2006.01) H05K 3/14 (2006.01)

Patent

CA 1336249

The process for depositing an adherent silver film, especially on a nonconducting substrate, involves depositing the silver film from the gas phase. A plasma discharge in a gas containing volatile silver organic compounds is used. The silver compounds advantageously contain silver atoms which are bonded to an sp2-hybridized carbon atom and are halogen- containing, particularly fluorine-containing compounds. The compounds CF3-CAg=CF-CF3, CF3-CAg=CF2 and pentafluorophenyl silver may be used. The silver film so formed may be strengthened electrochemically or by chemical reduction. The silver film products are useful as electrically conducting, decorative or reflective layers.

608433

Affiliated with

Also associated with

Rating

Procedure for the deposition of firmly adhering silver films does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Procedure for the deposition of firmly adhering silver films, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Procedure for the deposition of firmly adhering silver films will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1340817